Numerical study on a heat transfer model in the solid-carbon/liquid-copper system

Abstract

The thermal conductivity of solid carbon and liquid copper-silicon by using Fourier law, can be utilized as a viable technique to grow superior warm administration materials. The investigation reveals that the thermal conductivity of carbon/copper (C/Cu) composites changes because of the silicon carbide (SiC) relocation from the matrix to the interface. C/Cu composites were used to predict the value of heat flux at different thicknesses of SiC materials. Several studies on heat transfer coefficients in the literature have been reported. However, most of them are experimental reports and only a little fundamental theoretical work have been reported. The possible reasons for this gap might arise from the difficulties of studying the high-temperature and vacuum conditions. A model for the numerical simulation of heat transfer in the solid-carbon/ liquid copper-silicon system is presented.